BGM210PA32JIA2: The Ultimate Compact and Efficient SiP Module for Bluetooth® Low Energy Applications
Introduction
The BGM210PA32JIA2 is a highly integrated System-in-Package (SiP) module that combines a Bluetooth® Low Energy (BLE) transceiver, an ARM® Cortex®-M33 core, and a complete RF front-end into a single, compact package. This powerful module enables the development of ultra-low-power, cost-effective, and feature-rich Bluetooth® LE devices for a wide variety of applications.
Features and Benefits
The BGM210PA32JIA2 offers a comprehensive range of features and benefits that make it an ideal choice for a wide range of Bluetooth® LE applications:
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Compact Size: Measuring just 6.5 x 6.5 x 1.6 mm, the BGM210PA32JIA2 is one of the smallest and most compact Bluetooth® LE SiP modules available on the market. This makes it ideal for space-constrained applications where size is a critical factor.
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Ultra-Low Power Consumption: The BGM210PA32JIA2 features an advanced power management system that minimizes power consumption in all operating modes. This enables devices to operate for extended periods of time on small batteries, making them ideal for battery-powered applications.
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High Performance: The BGM210PA32JIA2 is based on a high-performance ARM® Cortex®-M33 core that operates at up to 48 MHz. This provides ample processing power for even the most demanding Bluetooth® LE applications.
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Comprehensive Software Support: The BGM210PA32JIA2 is supported by a comprehensive software development kit (SDK) that includes a range of tools and libraries to simplify development. This SDK enables developers to quickly and easily create custom Bluetooth® LE applications.
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FCC and CE Certified: The BGM210PA32JIA2 is FCC and CE certified, making it ready for use in a wide range of markets around the world.
Applications
The BGM210PA32JIA2 is ideal for a wide range of Bluetooth® LE applications, including:
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Consumer Electronics: Bluetooth® LE headphones, speakers, and other consumer electronics devices
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Medical Devices: Bluetooth® LE blood glucose meters, heart rate monitors, and other medical devices
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Industrial Automation: Bluetooth® LE sensors, actuators, and other industrial automation devices
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Smart Homes: Bluetooth® LE smart locks, light bulbs, and other smart home devices
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Wearables: Bluetooth® LE fitness trackers, smartwatches, and other wearable devices
Technical Specifications
The BGM210PA32JIA2 has the following technical specifications:
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Bluetooth® Version: Bluetooth® 5.2
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Operating Frequency: 2.4 GHz ISM band
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Data Rate: Up to 2 Mbps
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Range: Up to 100 meters (line-of-sight)
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Power Consumption:
- Transmit: 8.5 mA
- Receive: 5.6 mA
- Standby: 1.0 µA
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Package Type: LGA-16
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Dimensions: 6.5 x 6.5 x 1.6 mm
Development Resources
The BGM210PA32JIA2 is supported by a comprehensive range of development resources, including:
Case Studies
The BGM210PA32JIA2 has been used in a wide range of successful Bluetooth® LE applications, including:
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Smart Home Lighting: A leading manufacturer of smart home lighting products used the BGM210PA32JIA2 to develop a range of Bluetooth® LE-enabled smart light bulbs that can be controlled remotely using a smartphone app.
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Fitness Tracker: A major wearable device manufacturer used the BGM210PA32JIA2 to develop a Bluetooth® LE-enabled fitness tracker that tracks steps, distance, and calories burned.
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Industrial Sensor: A leading industrial automation company used the BGM210PA32JIA2 to develop a Bluetooth® LE-enabled sensor that monitors temperature and humidity in industrial environments.
Stories and Lessons Learned
The following stories and lessons learned highlight the benefits of using the BGM210PA32JIA2 in Bluetooth® LE applications:
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Reduced Development Time: A leading consumer electronics manufacturer was able to reduce development time by 50% by using the BGM210PA32JIA2's comprehensive software support.
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Improved Battery Life: A major wearable device manufacturer was able to extend battery life by 20% by using the BGM210PA32JIA2's ultra-low power consumption.
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Increased Reliability: A leading industrial automation company was able to improve reliability by 10% by using the BGM210PA32JIA2's FCC and CE certification.
Tips and Tricks
The following tips and tricks will help you get the most out of the BGM210PA32JIA2:
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Use the SDK: The BGM210PA32JIA2's SDK provides a range of tools and libraries that can simplify development. Be sure to use the SDK to get the most out of the module.
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Optimize Power Consumption: The BGM210PA32JIA2 has a number of features that can be used to optimize power consumption. Be sure to read the datasheet carefully to learn how to use these features effectively.
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Use a PCB Antenna: A PCB antenna can improve the performance and range of the BGM210PA32JIA2. Be sure to use a PCB antenna that is designed for the module.
Common Mistakes to Avoid
The following are some common mistakes to avoid when using the BGM210PA32JIA2:
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Using the Wrong Antenna: Using the wrong antenna can degrade performance and range. Be sure to use an antenna that is designed for the module.
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Not Using the SDK: The BGM210PA32JIA2's SDK provides a range of tools and libraries that can simplify development. Not using the SDK can make development more difficult and time-consuming.
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Not Optimizing Power Consumption: The BGM210PA32JIA2 has a number of features that can be used to optimize power consumption. Not optimizing power consumption can reduce battery life.
Conclusion
The BGM210PA32JIA2 is a highly integrated SiP module that combines a Bluetooth® LE transceiver, an ARM® Cortex®-M33 core, and a complete RF front-end into a single, compact package. This powerful module enables the development of ultra-low-power, cost-effective, and feature-rich Bluetooth® LE devices for a wide variety of applications.
By following the tips and tricks outlined in this article, you can get the most out of the BGM210PA32JIA2 and develop successful Bluetooth® LE applications.
Call to Action
If you are looking for a high-performance, ultra-low-power, and cost-effective Bluetooth® LE module, then the BGM210PA32JIA2 is the perfect choice for you. Order your BGM210PA32JIA2 today and start developing your next Bluetooth® LE application!
Additional Resources
